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Hysitron Webinars

Hysitron is committed to the growth of the nanotechnology field and has made a concerted effort to provide solutions for customers to help them excel in their research.

All webinars are recorded and are available for on-demand viewing, in case you are unable to participate in the live webcast.

Tribological properties play a critical role in the proper function, longevity, and energy efficiency of mechanical systems. The ability to quantitatively characterize surface interactions over the nanoscale and microscale provides a new understanding of how to better control friction and wear behavior in bulk material systems and thin tribological films.

In this webinar we will discuss the theory and applications of tribological and mechanical characterization over the nanometer to micrometer length scales. Practical applications will be presented relating to the field of lubricated sliding materials found in pistons, bearings, rubber gaskets, and other interacting components used in engines and power trains. We will demonstrate how nanoscale indentation and scratch testing provides powerful information for studying localized changes due to tribological processes and how these complimentary techniques provide greater insight to optimize tribological performance.

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Bruker’s nanoDMA® III testing mode substantially increases the characterization capabilities throughout the Hysitron nanoindentation product family. nanoDMA III is an indentation-based dynamic mechanical analysis technique that superimposes a small force oscillation over a static load to deliver quantitative and repeatable mechanical characterization over the nanometer-to-micrometer length scales. This webinar discusses nanomechanical properties of elastic-plastic and viscoelastic materials and the influence of environmental conditions such as temperature & humidity. We will explore the material response to stress (creep & relaxation) and to an oscillating indenter probe at changing frequencies. Additionally, we will review possibilities to quantitatively map the elastic modulus of surfaces.

In this webinar, we provide a brief overview of quasi-static and dynamic nanoindentation, dynamic nanoindentation measurement theory and best practices, the applications of: depth profiling of elastic-plastic mechanical properties; viscoelastic characterization—storage modulus, loss modulus, tan-delta; and combined dynamic nanoindentation and environmental control.

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Nanoindentation techniques have long had an important role in quantitatively evaluating the mechanical properties of microstructural features. In recent years, high speed nanoindentation mapping techniques have been under development and have recently achieved speeds up to 6 indents/second, approximately 500x faster than traditional nanoindentation mapping methodologies. This enables a one-to-one correlation with other techniques, such as EBSD, and provides corresponding large data sets for robust statistical analysis. This correlation can produce high resolution structure-property relationships which can be mapped over sub-micron to several hundreds of micron length scales. High speed nanoindentation has numerous potential applications, from evaluation of microstructure-property evolution during processing, quality control testing of weld zones, evaluation of sub-surface damage gradients (wear, corrosion, irradiation), composite material interfaces, and more.

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The TriboScope® seamlessly interfaces with Atomic Force Microscopes to deliver quantitative and repeatable mechanical and tribological characterization over the nanometer-to-micrometer length scales. By utilizing a rigid test probe, the TriboScope enables static and dynamic instrumented indentation. This webinar will discuss nanomechanical properties are obtained via AFM based nanoindentation comparing rigid probe vs cantilever based measurements. We will explore true force and displacement feedback control modes and cover applications from soft polymers to hard ceramics. Additionally, we will review nano-scratch, nano-wear and nanoDMA techniques and applications.

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