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nanoDMA III - Dynamic Nanoindentation | Hysitron, Inc.
nanoDMA III | Hysitron, Inc.

nanoDMA® III

Dynamic Nanoindentation - Quantitative Nanoscale Viscoelastic Property Measurements

Hysitron’s nanoDMA III (nanoscale Dynamic Mechanical Analysis) is a powerful new dynamic testing technique used to perform nanoscale mechanical property measurements. nanoDMA III is equipped with newly developed CMX control algorithms to provide a truly continuous measurement of mechanical properties as a function of depth into a material’s surface. CMX provides a quantitative and truly continuous measurement of mechanical properties — including hardness, storage modulus, loss modulus, complex modulus, and tan delta — as a function of indentation depth, frequency, and time.

High bandwidth transducer and control electronics are fully optimized for nanoscale dynamic testing and provide industry-leading performance, sensitivity, and a broad dynamic range. Hysitron’s unique coupled AC/DC force modulation routine enables true nanoscale mechanical characterization and is not subjected to the slow feedback response times that plague other nanoscale dynamic stiffness techniques. nanoDMA III incorporates a unique reference frequency technique for thermal drift correction during the course of an experiment, enabling long-duration frequency sweeps and creep tests to be reliably performed at the nanoscale.

Hysitron's nanoDMA® III Features

  • Newly developed CMX algorithms, providing a truly Continuous Measurement of properties (hardness, storage modulus, loss modulus, complex modulus, tan-delta) as a function of contact depth, frequency and time
  • Universally applicable technique for the thorough nanoscale characterization of materials, from ultra-soft hydrogels to hard thin films
  • High bandwidth electronics for a greatly improved signal to noise ratio and faster testing cycles
  • Enhanced dynamic characteristics and dynamic testing range (0.1Hz to 300Hz), enabling increased accuracy and applicability on the broadest range of materials
  • Flexible graphical user interface for rapid test setup, execution, and increased data analysis and reporting capabilities
  • Coupled AC and DC force modulation for reliable and quantitative nanoscale dynamic characterization from the initial surface contact
  • Automated testing routines for increased sample throughput
  • In-situ drift correction capabilities for maximum accuracy during long test cycles

Additional nanoDMA® III Information