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Packaging | Hysitron, Inc.
Packaging | Hysitron, Inc.

Quantitative Nanomechanical Testing of Packaging Materials

Electronic packaging utilizes a broad set of materials with challenging integration issues in terms of evaluating tradeoffs between function, performance, reliability, manufacturability, and cost. Packaging materials oftentimes are multi-functional, providing a unique combination of physical function and mechanical support. Performance and reliability of packaging materials are dictated by their electrical, chemical, thermal, and mechanical characteristics. Increasing the reliability of electronic devices is accomplished by engineering new materials with unique characteristics combined with optimal package design. 

Hysitron’s suite of nanomechanical test equipment provides new insights into the mechanical properties of packaging materials. These highly sensitive and spatially resolved testing techniques provide quantitative measurement of the modulus of elasticity, hardness, fracture toughness, wear performance, adhesion, stress relaxation, and creep resistance of materials used for interconnects, substrates, dielectrics, die attach materials, electrical contacts,  thermal materials, and solders. Hysitron’s nanoscale measurement technologies assist in optimizing mechanical performance  for enhanced product reliability.

 Test Equipment for Packaging Materials Characterization

Packaging Applications Examples