Quantitative Nanomechanical Testing of Packaging Materials
Electronic packaging utilizes a broad set of materials with challenging integration issues in terms of evaluating tradeoffs between function, performance, reliability, manufacturability, and cost. Packaging materials oftentimes are multi-functional, providing a unique combination of physical function and mechanical support. Performance and reliability of packaging materials are dictated by their electrical, chemical, thermal, and mechanical characteristics. Increasing the reliability of electronic devices is accomplished by engineering new materials with unique characteristics combined with optimal package design.
Hysitron’s suite of nanomechanical test equipment provides new insights into the mechanical properties of packaging materials. These highly sensitive and spatially resolved testing techniques provide quantitative measurement of the modulus of elasticity, hardness, fracture toughness, wear performance, adhesion, stress relaxation, and creep resistance of materials used for interconnects, substrates, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. Hysitron’s nanoscale measurement technologies assist in optimizing mechanical performance for enhanced product reliability.
Test Equipment for Packaging Materials Characterization
- TI 980 TriboIndenter®
- TI 950 TriboIndenter®
- TI Premier
- TS 75 TriboScope®
- PI 85L SEM PicoIndenter®
- PI 88 SEM PicoIndenter®
- PI 95 TEM PicoIndenter®
Packaging Applications Examples
- Thermal Expansion in a TSV Structure
- Mechanical Characterization of Pb-Free Solder Bumps
- In-Situ Mechanical Testing of Semiconductor Devices