Quantify mechanical and tribological properties of thin films along with device actuation forces and electrical contact resistance
Semiconductor & Electronics
The prevailing theme in Semiconductor and Electronics manufacturing is to continuously make devices smaller, faster, cheaper, and more efficient. This oftentimes requires introducing new processing technologies and materials when historic technologies reach their design limits. With ever-decreasing length scales and the integration challenges of new materials, new characterization techniques are required to develop next-generation materials and validate new processes.
Hysitron has developed a diverse product portfolio to characterize material properties, tribological properties, and interfacial properties of electronic materials at the nanometer length scale. These enabling technologies allow researchers to probe localized properties to accelerate new material understanding, fast-track integration, and guarantee product reliability.
Measurement Technologies for Smaller, Faster, Cheaper, and More Reliable Products
Understand how packaging materials interact with each other and how to maximize package integrity and reliability.
Measure the effects of processing conditions on the elastic and viscoelastic properties of thin films and small structures.
Quantify the mechanical and interfacial properties of organic and inorganic device layers.
Explore new materials and discover mechanical and interfacial property changes as a function of operation and processing conditions.
Measure the mechanical reliability and tribological performance of ultra-thin carbon coatings.