Ultra-Thin Films (<50nm)
Quantifing the Unknown - Nanomechanical, Nanotribological, and Interfacial Adhesion Characterization of Ultra-Thin Films
Ultra-thin films are used in a variety of technologically advanced applications. Most ultra-thin films are grown using complex chemical and physical deposition techniques using gas-phase precursers and plasma processes. Successful integration of these films into usable products requires the ability to quantitatively measure mechanical, tribological, and interfacial properties of films only a few atomic layers thick.
Hysitron is the industry leader in nanomechanical and nanotribological property characterization of ultra-thin films. Continued development of nanoindentation technologies and techniques has enabled the force sensitivity, displacement sensitivity, and control algorithms necessary for quantitative ultra-thin film measurements. Patented models remove substrate effects from the nanoindentation data to obtain intrinsic thin film modulus values.
Hysitron’s nanoscratch testing technologies enables quantitative tribological and interfacial adhesion characterization of ultra- thin films. Patented electrostatic transducer technology with 2 dimensional actuation capabilities enable highly sensitive measurements of forces acting on the scratch probe during normal loading and lateral actuation, providing highly sensitive nanoscale tribological and interfacial adhesion characterization capabilities.
Test Equipment for Quantitative Ultra-Thin Film Characterization
- TI 980 TriboIndenter®
- TI 950 TriboIndenter®
- TI Premier
- TS 75 TriboScope®
- PI 85L SEM PicoIndenter®
- PI 88 SEM PicoIndenter®
- PI 95 TEM PicoIndenter®