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News & Events

One of Hysitron's commitments and core competencies is to promote knowledge in the field of nanomechanics. We do this through exhibiting and participating in conferences, meetings, workshops and tradeshows throughout the year.  We are also committed to research and publish through internal research and key collaborations. Check back here often to find the latest in released papers and when our paths may cross at a conference.

Hysitron invites you to join us at the Microscopy & Microanalysis 2016 Meeting, July 24 - 28 in Columbus, OH. We will be sharing our latest developments in state-of-the-art nanomechanical testing solutions. Stop by Booth 1206 to discuss your materials characterization challenges and learn how Hysitron technology can help advance your research.

Live Instrument Demo
Quantitative In-Situ Tribology in the SEM with Hysitron and TESCAN
Date: Wednesday, July 27
Time: 12:00 - 1:00PM (Lunch provided)
Location: TESCAN - Booth 620
Over lunch, you will learn about Hysitron's next generation of in-situ nanomechanical testing instruments along with the latest in FIB-SEM technology from TESCAN. Hysitron will also perform a live demonstration of an SEM PicoIndenter equipped with the all-new nanoScratch option with lateral force sensing for in-situ tribology. As you will see, the pairing of high performance electron microscopy with quantitative scratch testing is a powerful new technique for studying the tribological properties of materials at the nano and micrometer scales.
Space is limited - Click here to RSVP!

Scientific Presentation
In Situ SEM Study of Mechanical Properties of Aluminide Bond Coating at Elevated Temperatures
Date: Tuesday, July 26
Time: 11:45AM
Location: Room C215

Hysitron invites you to join us at The 17th International Conference on Electronic Packaging Technology (ICEPT), August 16 - 19 in Wuhan, China. We will be sharing our latest developments in state-of-the-art nanomechanical testing solutions. Stop by our booth to discuss your materials characterization challenges and learn how Hysitron technology can help advance your research.

Hysitron invites you to join us at The 16th European Microscopy Congress (EMC2016), August 28 - September 2 in Lyon, France. We will be sharing our latest developments in state-of-the-art nanomechanical testing solutions. Stop by Booth 68 to discuss your materials characterization challenges and learn how Hysitron technology can help advance your research.

Scientific Presentation
In Situ TEM Study of Fatigue Crack Growth of Cu Thin Films Using a Modified Nanoindentation System
Date: Friday, September 2
Time: 10:30AM - 12:45PM
Location: MS 1-II

View programs and webpages from past Hysitron events and workshops. Click Here

Contact Hysitron

9625 West 76th Street
Minneapolis, MN 55344
United States
+1-952-835-6366

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