The TI 750 Ubi nanomechanical test instrument is a dedicated scanning nanoindenter. Its top-quality, robust and compact design combined with Hysitron's exclusive in-situ SPM imaging capability and performech control unit makes it superior in both function and performance. This affordable stand-alone nanomechanical test instrument is capable of performing a variety of quasi-static nanoindentation with upgradeable automation and nanoscratch capabilities. The direct coupling of Hysitron's patented three-plate capacitive transducer to an SPM piezo scanner enables true in-situ SPM imaging of the test surface immediately before and after the indentation test, eliminating the need for switching the heads or translating of the sample stage. The nanometer resolution in-situ imaging, tip positioning abilities, increased senstivity and feedback rate of the TI 750 Ubi with the performech control unit assist in the research of low displacement, high-resolution testing.

Integrated with low-noise three-plate capacitive transducers and electronics, the multi-layered enclosure and vibration isolation system provide excellent environmental separation for the instrument, equipping TI 750 with extremely low noise floors for both displacement and load measurements. The TI 750's Windows-based and user-friendly software has been written using the same platform as for TriboIndenter^® and TriboScope^®, which offers information and data exchange among users of any Hysitron instrument. TI 750 Ubi also comes with tip-view optics and a CCD camera system for easy and quick selection of testing locations on a multiple sample stage. In addition, the TI 750's compact design increases efficiency of laboratory space usage.

TI 750 allows the user to characterize the mechanical properties of a wide variety of materials including ceramics, metals, glasses, polymers, biomedical materials and biological samples, whether they are in the format of thin films, coatings, composites or bulk materials. TI 750 provides readily available experimental results and quantitative data for hardness, elastic modulus, fracture toughness, ramped and constant force scratch resistance, friction coefficient, wear, and thin film interfacial adhesion.

• Hysitron’s uniquely patented in-situ SPM imaging as standard
• Performech advanced control module with DSP technology
• 26x faster feedback for superior control
• Increased force sensitivity with a <30nN noise floor for unprecedented accuracy
• Enhanced lateral measurements for ultra-thin film tribological characterization
• Intelligently programmed software with enhanced testing routines
• Faster sample approach and settle time for high throughput testing
• In-situ imaging provides nanometer precision positioning and the convenience of SPM topography
• Acoustic and thermal enclosure, along with stable transducer design, minimizes set-up and stabilization time
• Standard tip-view optics upgradeable to top-down optics for viewing and selection of testing sites
• Passive vibration isolation table upgradeable to active vibration isolation table
• Sub-micron resolution staging for sample positioning
• Numerous add-ons that allow the widest array of testing capabilities on the market