Hysitron Logo | Nanoindentation & Nanomechanical Testing Instruments

 Contact Hysitron
 P: +1-952-835-6366
 F: +1-952-835-6166
 Request Information
 Global Contacts
 Directions

 

NEW  nanoDMA® III

Hysitron's nanoDMA III is a powerful new dynamic testing technique used to perform nanoscale mechanical property measurements. nanoDMA III is equipped with newly developed CMX control algorithms to provide a truly continuous measurement of mechanical properties as a function of depth into a material's surface. High bandwidth transducer and control electronics are fully optimized for nanoscale dynamic testing and provide industry-leading performance, sensitivity, and a broad dynamic range. Hysitron's unique coupled AC/DC force modulation routine enables true nanoscale mechanical characterization and is not subjected to the slow feedback response times that plague other nanoscale dynamic stiffness techniques. TriboScan v.9 control software incorporates an intuitive graphical user interface to speed test setup and execution, enhanced data analysis and plotting capabilities, and in-situ drift correction capabilities for accurate results during long test durations.

nanoDMA III | Depth Profile | Hysitron
A CMX depth profile on (100) Aluminum from 2nm - 110nm.
Discontinuities in the data are due to dislocation bursts
occuring during the nanomechanical test.

nanoDMA III | Frequency Sweeps | Hysitron
0.1Hz - 200Hz frequency sweeps on various polymers utilizing
the reference frequency technique. Note the beta transition seen
on PMMA as indicated by the small tan-delta peak near 10Hz
.

nanoDMA III | Modulus&Hardness | Hysitron
Modulus and hardness as a function of contact depth from multiple
tests on (A) fused quartz, (B) low-κ film. Each curve is comprised of
3000 individual data points taken in 30 seconds. 

nanoDMA III | Creep Test | Hysitron
1 hour creep test on copper and cement using the reference
frequency creep testing technique.

 

 

Hysitron's nanoDMA III features:

  • Newly developed CMX algorithms, providing a truly Continuous Measurement of X (X = hardness, storage modulus, loss modulus, complex modulus, tan-delta, etc.) as a function of contact depth, frequency and time
  • Universally applicable technique for the thorough nanoscale characterization materials, from ultra-soft hydrogels to hard coatings 
  • High bandwidth electronics for a greatly improved signal to noise ratio and faster testing cycles 
  • Enhanced dynamic characteristics and dynamic testing range (0.1Hz to 300Hz), enabling increased accuracy and applicability on the broadest range of materials 
  • Flexible graphical user interface for rapid test setup, execution, and increased data analysis and reporting capabilities
  • Coupled AC and DC force modulation for reliable and quantitative nanoscale dynamic characterization from the initial surface contact 
  • Automated testing routines for increased sample throughput
  • In-situ drift correction capabilities for maximum accuracy during long test cycles

 

pdf PDF (1.8 MB) nanoDMA III Information Sheet                                                          
pdf PDF (0.4 MB) Temperature and Frequency Dependence in PMMA