MEMS
Micro-Electro-Mechanical Systems (MEMS) technology combines mechanical and electrical components to form highly-functional, yet small-scale systems for use in many emerging applications today. As MEMS fabrication techniques improve and MEMS components decrease in size, mechanical characterization at the nanoscale becomes not just useful, but an absolute necessity to assess performance and mechanical integrity of such small structures.
Hysitron's instruments provide mechanical characterization of MEMS devices, including hardness and modulus testing, static and dynamic structural mechanics of MEMS components, fatigue testing, stiction and friction measurement, and adhesion force quantification. In addition, Hysitron's instruments also characterize the other properties important and unique to MEMS devices, including stiffness, surface roughness, displacement range, actuation force, critical load to failure, and MEMS electro-mechanical transfer functions. Users can utilize Hysitron's in-situ SPM imaging to precisely identify test locations, features, and events.
Furthermore, Hysitron's nanoECR option provides researchers with a simultaneous in-situ electrical and mechanical measurement capability. This combinatorial in-situ testing technique provides additional insight into MEMS performance and functionality not obtainable using traditional one-dimensional testing techniques.